OSTEC R&D Resources Survey
OSTEC is developing an on-line database of specialized equipment, facilities, and capabilities that are available to companies conducting R&D in the region.
High Density Design Inc
Contact: Lawrence Regnier
Email: pcb@highdensitydesign.net
Phone: (250) 766-1434
Website: http://www.highdensitydesign.net
Company Bio:
Prototype Design:
High Density Design provides designs of exceptional quality, tailored to customer’s requirements. Design services include printed circuit board design, schematic entry, library management, design rule check and assembly drawings.
Prototype Assembly:
High Density Design is fully equipped and experienced in dealing with surface mount, through-hole and BGA work.
Fabrication capability or facilities:
-Double Sided Surface Mount PCB layout and assembly, RoHS compliant
-Wave Solder machine for through hole assembly
-Surface Mount Reflow Oven, double sided reflow
-Surface Mount Pick and Place machine
-Board Washer
-Fast Turnaround prototype assembly (1 day)
R&D support capability or Tools:
- extensive PCB design services including RF, analog, high speed digital
- multilayer, BGA, controlled impedance
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www.spincaster.com
